用正交试验法优化挠性单面板精细线路的工艺  

Orthogonal optimization of single-sided flexible circuit technology

作　　者：胡友作[1] 薛卫东[1] 何为[1] 黄雨薪[1] 吕文驱 罗旭 刘振华 李启军 

机构地区：[1]电子科技大学微电子与固体电子学院,四川成都610054 [2]梅州博敏电子股份有限公司,广东梅州514000

出　　处：《印制电路信息》2012年第1期49-52,共4页Printed Circuit Information

摘　　要：在制成能力为70μm/70μm的设备上探索进行理论线间距为40μm/40μm的挠性板精细线路工艺研究过程中,用正交试验法的L9(34)正交表安排蚀刻速度、曝光能量和显影速度三因素试验。试验发现,显影速度对精细线路影响最大,其最佳工艺优化参数为A1B3C2,即蚀刻速度为5.5 m/min、显影速度为2.8 m/min和曝光能量为60 mj。In this paper L9（34） orthogonal arrangement is used to take the orthogonal experiment which includes three factors.We take the device with theoretical production process is 70μm/70μm to produce single-sided flexible printed circuit board with line and space 40μm/40μm.The factors are etching speed,exposure energy and developing speed.The results of the experiment showed that developing speed is the factor which play the most important role during the fine line manufacturing and the best parameters are 5.5m/min of etching speed,2.8m/min of developing speed and 60mj of exposure energy.

关 键 词：精细线路 正交试验法 挠性板 

分 类 号：TN41[电子电信—微电子学与固体电子学]