AZ31镁合金扩散钎焊界面区域的组织结构及性能  

Microstructure and Properties of Interfacial Region of AZ31 Alloy by Diffusion Brazing

作　　者：杜双明[1] 赵维涛[1] 刘刚[1] 郭伟[1] 

机构地区：[1]西安科技大学材料科学与工程学院,陕西西安710054

出　　处：《热加工工艺》2012年第1期140-141,144,共3页Hot Working Technology

摘　　要：以50μm厚的纯铜箔作为中间层对AZ31镁合金进行了真空扩散钎焊工艺试验;利用金相显微镜、X射线衍射及显微硬度计对接头扩散区的显微组织及硬度进行了测试与分析。结果表明,在加热温度为520℃、压力为1MPa、保温时间为10～30 min时能得到良好的扩散钎焊接头,扩散钎焊界面区形成了Mg2Cu新相;接头扩散区的显微硬度范围为100～550HV,高于AZ31母材的显微硬度;扩散区靠近镁合金基体的两侧区域的硬度较扩散区中心的硬度高,随着保温时间的延长,扩散区的显微硬度和宽度也相应增大。AZ31 alloy was welded by vacuum diffusion brazing using 50μm pure Cu foil as interlayer.The microstructure of diffusion joint was tested and analyzed by optical microscope,X-ray diffraction.The microhardness of diffusion joint was measured.The results show that the good joint of diffusion brazing of AZ31 alloy can be obtained under the temperature of 520 ℃,pressure of 1 MPa and holding time of 10 ~ 30 min.Mg2Cu phase is formed in the interfacail region of AZ31 alloy.The microhardness of interfacial regin is 100~550 HV,which is higher than that of AZ31alloy.The microhardness of interfacial region near to AZ31 alloy is higher than that of near to the center of interfacial regin.The microhardness and width of diffusion zone increase with the increase of holding time.

关 键 词：AZ31镁合金 Cu中间层 扩散钎焊 显微组织 

分 类 号：TG454[金属学及工艺—焊接]