玻璃/铝/玻璃三层结构阳极键合机理分析  

Mechanism analysis of anodic bonding between glass/aluminum/glass layer

作　　者：秦会峰[1] 孟庆森[2] 

机构地区：[1]山西机电职业技术学院材料工程系,山西长治046100 [2]太原理工大学材料科学与工程学院,山西太原030024

出　　处：《兵器材料科学与工程》2012年第1期32-34,共3页Ordnance Material Science and Engineering

基　　金：国家自然科学基金资助项目(50375105)

摘　　要：对玻璃/铝/玻璃3层结构进行阳极键合试验,分析键合温度和电压对键合电流的影响;通过扫描电镜对键合界面的微观结构进行分析,表明键合界面良好;对玻璃/铝/玻璃3层结构阳极键合机理进行探讨,认为键合界面处接通电流瞬间产生的强大的静电场力是实现玻璃/铝/玻璃界面紧密接触并形成良好界面键合的主要原因。Anodic bonding of glass/aluminum/glass three-layer was achieved,the influence of bonding temperature and voltage on bonding current was analyzed.The microstructure of bonding interface was analyzed by SEM.It shows that the bonding interface is perfect.The mechanism of the anodic bonding of glass/aluminum/glass three-layer was discussed.It is believed that the main reason of three-ayer anodic bonding and the excellent interface bond is the generation of great electrostatic force,which makes the interface closely contact.

关 键 词：阳极键合 硼硅玻璃 铝 界面 

分 类 号：TG453[金属学及工艺—焊接]