衍射方法监控键合线断裂  

Diffractive Method for Bonding Wire Breakage Monitoring

作　　者：肖勇[1] 逄玉俊[1] 葛晓宇[1] 高淑芝[1] 

机构地区：[1]沈阳化工大学信息工程学院,辽宁110142

出　　处：《无损检测》2011年第12期86-89,103,共4页Nondestructive Testing

摘　　要：在制造行业中,键合线广泛用于连接半导体芯片焊点和封装接线端。随着工厂自动化程度的不断提高,急需配置智能传感器来监控键合线的断丝故障,可是芯片和键合线的发展趋势是越来越精细,这给当前的键合线监控方法带来了严峻的挑战。提出了基于单缝衍射的精细键合线监控方法,通过观测特定衍射条纹的光强变化来判断键合线的存在与否。试验结果表明,对于直径为25μm或更精细的键合线,此方法可以达到理想的监控效果。In manufacturing industry, bonding wires are used to interconnect the pads of a semiconductor chip to terminals of a package containing the chip. With advance of factory automation, it is necessary to introduce intelligent sensor to monitor breakage of bonding wire. As chip size and diameter of bonding wire become smaller and smaller, current monitoring methods encounter a lot of limitations. In this paper, a method to monitor breakage of fine bonding wires using single-slit diffraction is proposed, where irradiance variation of the corresponding diffraction pattern at the special receiver could be observed, due to the presence of a wire. Experimental results demonstrate that the proposed method renders satisfactory monitoring performance for bonding wire with a diameter of 25 μm or less.

关 键 词：键合线 衍射条纹 光强 光电阵列 

分 类 号：TG115.28[金属学及工艺—物理冶金] TN219[金属学及工艺—金属学]