大功率集成功放模块工艺研究  

Study on High Power Integrated Amplifier Module

作　　者：刘笛[1] 刘洪涛[1] 贺玲[1] 

机构地区：[1]中国电子科技集团公司第47研究所,沈阳110032

出　　处：《电子与封装》2012年第1期21-24,共4页Electronics & Packaging

摘　　要：在各类电子产品集成度越来越高的前提下,大功率集成功放模块也同样面临着集成度不断提高的要求,如何使其效率更高、体积更小、重量更轻、成本更低、更加可靠耐用已成为大功率集成功放模块工艺研究的主要方向。文章介绍了一种大功率集成功放模块的封装结构设计及组装工艺,功率半导体模块是把若干分立器件及内部电路进行组装,然后用环氧树脂灌封而成的新型器件。它具有体积小、外壳与电极绝缘、可靠性高、安装方便等优点。在研制过程中借鉴了国外知名企业产品的工艺技术,同时也充分利用了现有成熟的半导体集成电路的封装技术。With All kinds of electronic products have become increasingly integrated, high-power integrated amplifier module is also facing the same requirements and ever-increasing integration, how to make it more efficient, smaller, lighter weight, lower cost, more become a reliable and durable high-power amplifier module integrated on the main direction of the process.This paper describes a high-power amplifier module integrated package design and assembly processes, power semiconductor module is internal to a number of discrete devices and circuits to be assembled, and then use the new devices made of epoxy potting. It has small size, shell and electrode insulation, high reliability, convenient installation. In the development process to learn from foreign well-known enterprise product technology, but also make full use of existing mature semiconductor integrated circuit packaging technologies.

关 键 词：集成功放 模块 环氧树脂 灌封 

分 类 号：TN405[电子电信—微电子学与固体电子学]