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作 者:Cheng Wei Zhao Yan Gao Hanchao Chen Chen Yang Naibin 程伟;赵岩;高汉超;陈辰;杨乃彬(Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing Electronic Devices Institute,Nanjing 210016,China)
出 处:《Journal of Semiconductors》2012年第1期56-58,共3页半导体学报(英文版)
摘 要:An InGaAs/InP DHBT with an InGaAsP composite collector is designed and fabricated using triple mesa structural and planarization technology. All processes are on 3-inch wafers. The DHBT with an emitter area of 1×15 μm2 exhibits a current cutoff frequency ft = 170 GHz and a maximum oscillation frequency fmax = 256 GHz. The breakdown voltage is 8.3 V, which is to our knowledge the highest BVcEo ever reported for InGaAs/InP DHBTs in China with comparable high frequency performances. The high speed InGaAs/InP DHBTs with high breakdown voltage are promising for voltage-controlled oscillator and mixer applications at W band or even higher frequencies.An InGaAs/InP DHBT with an InGaAsP composite collector is designed and fabricated using triple mesa structural and planarization technology. All processes are on 3-inch wafers. The DHBT with an emitter area of 1×15 μm2 exhibits a current cutoff frequency ft = 170 GHz and a maximum oscillation frequency fmax = 256 GHz. The breakdown voltage is 8.3 V, which is to our knowledge the highest BVcEo ever reported for InGaAs/InP DHBTs in China with comparable high frequency performances. The high speed InGaAs/InP DHBTs with high breakdown voltage are promising for voltage-controlled oscillator and mixer applications at W band or even higher frequencies.
关 键 词:INP double heterojunction bipolar transistor PLANARIZATION
分 类 号:TN322.8[电子电信—物理电子学]
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