Spreading kinetics of a Sn-30Bi-0.5Cu alloy on a Cu substrate  

作　　者：ZANG LiKun YUAN ZhangFu ZHAN YaPeng WANG ChenYu XU BingSheng 

机构地区：[1]Department of Chemistry,School of Chemical and Biological Engineering,University of Science and Technology Beijing,Beijing 100083,China [2]College of Engineering,Peking University,Beijing 100871,China

出　　处：《Chinese Science Bulletin》2012年第6期682-686,共5页

基　　金：supported by the National Natural Science Foundation of China (50474043 and 50711140385)

摘　　要：The reactive wetting kinetics of a Sn-30Bi-0.5Cu Pb-free solder alloy on a Cu substrate was investigated by the sessile drop method from 493 to 623 K.The triple line frontier,characterized by the drop base radius R was recorded dynamically with a high resolution CCD using different spreading processes in an Ar-H 2 flow.We found a good agreement with the De Gennes model for the relationship between ln(dR/dt) and lnR for the spreading processes at 493 and 523 K.However,a significant deviation from the De Gennes model was found for the spreading processes at 548 and 623 K.Our experimental results show a complicated temperature effect on the spreading kinetics.Intermetallics at the Sn-30Bi-0.5Cu/Cu interface were identified as Cu 6 Sn 5 adjacent to the solder and Cu 3 Sn adjacent to the Cu substrate.The intermetallic compounds effectively enhanced the triple line mobility because of reaction product formation at the diffusion frontier.The reactive wetting kinetics of a Sn-30Bi-0.5Cu Pb-free solder alloy on a Cu substrate was investigated by the sessile drop method from 493 to 623 K. The triple line frontier, characterized by the drop base radius R was recorded dynamically with a high resolution CCD using different spreading processes in an Ar-H2 flow. We found a good agreement with the De Gennes model for the relationship between In（dR/d0 and lnR for the spreading processes at 493 and 523 K. However, a significant deviation from the De Gennes model was found for the spreading processes at 548 and 623 K. Our experimental results show a complicated temperature effect on the spreading kinetics. Intermetallics at the Sn-30Bi-0.5Cu/Cu interface were identified as Cu6Sn5 adjacent to the solder and Cu3Sn adjacent to the Cu substrate. The intermetallic compounds effectively enhanced the triple line mobility because of reaction product formation at the diffusion frontier.

关 键 词：传播过程 动力学 合金铜 基板 金属间化合物 关系模型 反应润湿 无铅焊锡 

分 类 号：TG142.15[一般工业技术—材料科学与工程] O313[金属学及工艺—金属材料]