国内外磁控溅射靶材的现状及发展趋势  

The Present Status and Development Trend of Magnetron Sputtering Target at Home and Abroad

作　　者：储志强[1] 

机构地区：[1]湖南省冶金材料研究所,湖南长沙410014

出　　处：《金属材料与冶金工程》2011年第4期44-49,共6页Metal Materials and Metallurgy Engineering

基　　金：湖南省科技厅工业科技计划重点项目;项目编号2009GK2006

摘　　要：近年来,随着磁控溅射技术的应用日趋广泛,对各种高纯金属及合金靶材的需求也愈来愈大。据此,介绍了磁控溅射靶材的种类、应用及制备情况,指出了目前靶材亟待解决的几个重大问题,并对靶材的发展趋势进行了探讨和展望。In recent year,with step and step widely of the magnetron sputtering technique application,the demands on high purity sputtering target materials are more and more great.In view of the above,the classification,application and preparation situation of the magnetron sputtering target materials are described,the several important questions about sputtering target materials which have to be resolved at moment are pointed out,moreover the development trend of sputtering target materials is also discussed and prospected in this paper.

关 键 词：磁控溅射 靶材 现状 发展趋势 

分 类 号：TN104.1[电子电信—物理电子学]