薄芯厚铜覆铜板工艺研究  

Study on the technology of the CCL with thin base material & thick copper foil

作　　者：马栋杰[1] 黄伟壮[1] 黄海林[1] 

机构地区：[1]广东生益科技股份有限公司,广东东莞523039

出　　处：《印制电路信息》2012年第2期17-19,52,共4页Printed Circuit Information

摘　　要：研究了厚铜箔轮廓、Rz轮廓等参数对薄芯覆铜板的厚度、耐电压等性能的影响,并针对各因素进行了相应试验和改进,可有效改善薄芯厚铜覆铜板相关性能。This article researches on the weight and roughness of thick cooper foil which affects the thickness and electrical resistance of the CCL with thin base material and thick copper foil,and makes experiment and improvement on those factors that improves the performance.

关 键 词：薄芯厚铜 厚度 铜箔轮廓 耐电压 

分 类 号：TN41[电子电信—微电子学与固体电子学]