塑封IC失效分析及对策  

Failure Analysis and Countermeasures for Plastic IC

作　　者：王立国[1] 邵刚[1] 

机构地区：[1]天水华天科技股份有限公司,甘肃天水741000

出　　处：《电子工业专用设备》2012年第1期27-32,共6页Equipment for Electronic Products Manufacturing

摘　　要：阐述了塑封IC(集成电路)常见的失效现象,对塑封IC失效的几种分析方法和分析技术做了叙述,然后提出塑封IC失效分析的步骤,并从设计、工艺和材料控制、包装、运输等方面提出改善塑封IC可靠性的措施。Described the failure of plastic IC common phenomenon in detail several of Plastic IC failure analysis methods and analysis techniques do narrative,and then put forward the steps Plastic IC failure analysis and design,process and material control,transportation and other aspects of the box measures to improve the reliability of plastic IC.

关 键 词：塑封IC 失效分析 改善措施 

分 类 号：TN305.94[电子电信—物理电子学]