Evolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging  

作　　者：Niwat Mookam Kannachai Kanlayasiri 

机构地区：[1]Department of Industrial Engineering Technology, Rajamangala University of Technology Rattanakosin Wang Klai Kangwon Campus,Prachuapkhirikhan 77110, Thailand [2]Department of Industrial Engineering, King Mongkut's Institute of Technology, Ladkrabang, Bangkok 10520, Thailand

出　　处：《Journal of Materials Science & Technology》2012年第1期53-59,共7页材料科学技术（英文版）

基　　金：the National Research Council of Thailand (NRCT) and the Faculty of Engineering, King Mongkut's Institute of Technology Ladkrabang for providing financial support

摘　　要：The growth, transformation, and lattice structure of intermetallic compounds formed between Sn-0.3Ag-0.7Cu lead-free solder and copper substrate were investigated. Dip soldering was used to initiate the reaction between the solder and substrate. An r/-Cu6Sn5 intermetallic phase possessing a hexagonal lattice structure was found at the as-soldered interface. Thermal aging at a number of conditions resulted in the formation of a CuaSn intermetallic phase between the Cu6Sn5 layer and the copper substrate, e-Cu3Sn with an orthorhombic lattice structure was found together with hexagonal CusSn. Subsequently, the activation energies of the intermetallic phases were calculated and compared to results obtained from the literature. The comparison showed that good agreement existed between the findings from this study and literature data within a similar temperature range.The growth, transformation, and lattice structure of intermetallic compounds formed between Sn-0.3Ag-0.7Cu lead-free solder and copper substrate were investigated. Dip soldering was used to initiate the reaction between the solder and substrate. An r/-Cu6Sn5 intermetallic phase possessing a hexagonal lattice structure was found at the as-soldered interface. Thermal aging at a number of conditions resulted in the formation of a CuaSn intermetallic phase between the Cu6Sn5 layer and the copper substrate, e-Cu3Sn with an orthorhombic lattice structure was found together with hexagonal CusSn. Subsequently, the activation energies of the intermetallic phases were calculated and compared to results obtained from the literature. The comparison showed that good agreement existed between the findings from this study and literature data within a similar temperature range.

关 键 词：SOLDERING INTERMETALLICS MICROSTRUCTURES Activation energy 

分 类 号：TG457.13[金属学及工艺—焊接]