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SOLDERING: 作品数：51被引量：68H指数：5; 导出分析报告; 相关领域：金属学及工艺一般工业技术更多>>; 相关作者：傅玉灿丁文锋杨长勇付建峰徐九华更多>>; 相关机构：金蝶软件(中国)有限公司南京航空航天大学国电南瑞科技股份有限公司哈尔滨工业大学更多>>; 相关期刊：更多>>; 相关基金：国家自然科学基金国家重点基础研究发展计划中国博士后科学基金国家教育部博士点基金更多>>

Research Status of Short Process Forming Techniques for Brazing and Soldering Materials: 《稀有金属材料与工程》2025年第2期377-384,共8页Dong Bowen Shi Guangyuan Zhong Sujuan Dong Xian Cheng Yafang Long Weimin Zhang Guanxing; National Key Research and Development Program(2021YFB3401101)。; Short process forming techniques for brazing and soldering materials can shorten the process,improve product quality,and increase production efficiency,which has received much attention from welding researchers.This r...; 关键词：short process forming technique continuous casting atomization powder soldering ball rapid solidification amorphous filler metals

In-situ Si particle-reinforced joints of hypereutectic Al−60Si alloys by ultrasonic-assisted soldering: 《Transactions of Nonferrous Metals Society of China》2025年第1期77-90,共14页Yuan-xing LI Xiang-bo ZHENG Chao-zheng ZHAO Zong-tao ZHU Yu-jie BAI Hui CHEN; financial support from the National Natural Science Foundation of China(Nos.52275385,U2167216);Sichuan Province Science and Technology Support Program,China(No.2022YFG0086).; To improve the wettability of hypereutectic Al−60Si alloy and enhance the mechanical properties of the joints,Al−60Si alloy was joined by ultrasonic soldering with Sn-9Zn solder,and a sound joint with in-situ Si parti...; 关键词：hypereutectic Al−60Si alloy ultrasonic-assisted soldering Si particle reinforcement Sn−9Zn solder

Ultrasonic-assisted soldering W90 Tungsten heavy alloy to AZ31B Mg alloy using Sn-x Al alloy: 《Journal of Materials Science & Technology》2024年第8期132-140,共9页Xudong Zhang Wei Fu Xiaoguo Song Liangbo Chen Zhuolin Li Shengpeng Hu Hong Bian; supported by the National Natural Science Foundation of China(nos.52105330 and 52175307);the Natural Science Foundation of Shandong Province(no.ZR2020QE175);the Taishan Scholars Foundation of Shandong Province(no.tsqn201812128).; A double-layered W/Mg structure is expected to be a new generation of nuclear radiation shielding material.The tungsten heavy alloy(W90)and AZ31B Mg alloy were firstly bonded by ultrasonic-assisted soldering using pur...; 关键词：Tungsten heavy alloy Mg alloy Ultrasonic-assisted soldering Mg_(2)Sn Cavitation effect

Preventing formation of intermetallic compounds in ultrasonic-assisted Sn soldering of Mg/Al alloys through pre-plating a Ni coating layer on the Mg substrate: 《Journal of Magnesium and Alloys》2024年第2期726-741,共16页Yingzong Liu Yuanxing Li Hui Chen Zongtao Zhu; financial support from the National Natural Science Foundation of China(grant numbers 52275385 and U2167216);the Sichuan Province Science and Technology Support Program(grant number 2022YFG0086)。; Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joi...; 关键词：Ultrasonic-assisted soldering Mg_(2)Sn Ni coating layer Shear strength

Low-temperature soldering process of AlN/Cu enhanced by Ti addition被引量：1: 《China Welding》2023年第3期36-40,共5页荆文王智新曹宇堃赵松柏宋北黄玉平; Aluminum Nitride(AlN)ceramics were soldered to Cu substrate using active metallized Sn0.3Ag0.7Cu-x%Ti(wt.%,where x=2,4,6,8)at 250℃.This process yielded a robust and closely integrated metallized layer on the AlN cera...; 关键词：reactive metallization BRAZING Alumimum Nitride copper

Interfacial reaction behavior and mechanical properties of 5A06 Al alloy soldered with Sn-1Ti-xGa solders at a low temperature: 《China Welding》2023年第2期23-31,共9页宋立志肖勇奚邦富李佳琪张建; the National Natural Science Foundation of China(No.52171045).; Active soldering of 5A06 Al alloy was performed at 300 ℃ by using Sn-1Ti and Sn-1Ti-0.3Ga active solders, respectively. Theeffects of soldering time on the microstructure and mechanical properties of the joints were ...; 关键词：5A06-Al alloy Sn-Ti-Ga solder low-temperature soldering interfacial reaction mechanical properties

Fluxless bonding with silver nanowires aerogel in die-attached interconnection: 《China Welding》2023年第2期32-41,共10页傅必成方毅张乐李道会齐放宋利军祝温泊; the National Natural Science Foundation of China(Grant No.52075125,No.52105331);the Shenzhen Science and Technology Innovation Committee(Grant No.JCYJ20210324124203009,No.JSGG20201102154600003,No.GXWD20220818163456002);Special Fund for Science and Technology Innovation Strategy of Guangdong Province(Grant No.pdjh2022b0570);Sustainedly Supported Fundation by National Key Laboratory of Science and Technology on Space Microwave under Grant HTKJ2022KL504011,and NIO University Programme(NIO UP).; The electronic product has gravitated towards component miniaturization and integration, employment of lead-free materials, and low-temperature soldering processes. Noble-metal aerogels have drawn increasing attention...; 关键词：silver nanowires aerogel nanostructured materials soldering preform BONDING curved surface

Bonding mechanisms of SiO_(2) glass and 1060 Al by ultrasonic assisted active metal soldering process被引量：5: 《China Welding》2023年第2期52-62,共11页武晓伟符军红卫首敬董红杰王健王浩然宋晓国李卓霖; In this work,the ultrasonic assisted active metal soldering of SiO_(2) glass and Al was successfully achieved using Sn-2Ti solder filler at a low soldering temperature of 250℃in ambient atmosphere.A nano-crystalline...; 关键词：BONDING microstructure intermetallic compounds interface OXIDATION FRACTURE

A review of soldering by localized heating被引量：1: 《China Welding》2023年第2期1-15,共15页崔鹏杨婉春彭飞祝温博杨帆李明雨; The research was supported by the National Natural Science Foundation of China(Grant No.52105331);the Shenzhen Science and Technology Innovation Committee(Grant No.JSGG20201102154600003,GXWD20220818163456002,JCYJ20210324124203009).; In recent years,the rapid development of the new energy industry has driven continuous upgrading of high-density and high-power devices.In the packaging and assembly process,the problem of differentiation of the therm...; 关键词：localized soldering high heat dissipation small size induction soldering focused heating

Fully Connected Convolutional Neural Network in PCB Soldering Point Inspection: 《Journal of Computer and Communications》2022年第12期62-70,共9页Bowen Cai; In Electronics Manufacturing Services (EMS) industry, Printed Circuit Board (PCB) inspection is tricky and hard, especially for soldering point inspection due to the extremely tiny size and inconsistent appearance for...; 关键词：Deep Learning Soldering Point Computer Vision Pattern Recognition Convolutional Neural Network Printed Circuit Board Electronics Manufacturing Services

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