BONDING

作品数：621被引量：962H指数：12
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相关领域：理学更多>>
相关作者：路明怀龚正虎郑建岚陶杰郭训忠更多>>
相关机构：北京交通大学中国科学院华中科技大学福州大学更多>>
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相关基金：国家自然科学基金国家重点基础研究发展计划中国博士后科学基金河北省自然科学基金更多>>
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Experimental and Numerical Study of Bonding Capacity of Interface between Ultra-High Performance Concrete and Steel Tube
《Structural Durability & Health Monitoring》2025年第2期285-305,共21页Ruikun Xu Jiu Li Wenjie Li Wei Zhang 
supported by grants from the Natural Science Foundation of Fujian Province(2021J011062);Minjiang Scholars Funding(GY-633Z21067).
This study investigates the bond performance at the interfacial region shared by Ultra-High Performance Concrete(UHPC)and steel tubes through push-out tests.This study examines how changes in steel fiber volumetric ra...
关键词：Ultra-high performance concrete filled steel tube(UHPCFST) push-out test bonding capacity cohesive zone model 
Electric-assisted diffusion bonding of Al_(0.3)CoCrFeNi high-entropy alloys:mechanisms and properties
《China Welding》2025年第1期1-11,共11页Mengchun Fu Jia Yang Jinze Lyu Panpan Lin Tiesong Lin Peng He 
support from National Natural Science Foundation of China(NSFC,Grant numbers U22A20185,U21A20128,52175302 and 52305353);Aeronautical Science Foundation(ASFC-20230036077001);Fundamental Research Funds for the Central Universities(2022FRFK060009,HIT.DZI1.2023012).
The excellent irradiation resistance,high strength and plasticity exhibited by high-entropy alloys(HEAs)make it candidate for engin-eering applications.Diffusion bonding of Al_(0.3)CoCrFeNi single-phase HEAs was carri...
关键词：High-entropy alloys Electric-assisted diffusion bonding Bonding mechanism Interfacial pore closure Shear strength 
Laser-induced thermo-compression bonding for Cu-Au heterogeneous nanojoining
《International Journal of Extreme Manufacturing》2025年第1期409-418,共10页Hui Wan Yu Shu Shuo Chen Hao Cao Shengjun Zhou Sheng Liu Chengqun Gui 
supported by the National Natural Science Foundation of China(Nos.52305612 and U20A6004);Open Fund of Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration(Wuhan University)(NO.EMPI2023015).
Surface tension-induced shrinkage of heterogeneously bonded interfaces is a key factor in limiting the performance of nanostructures.Herein,we demonstrate a laser-induced thermo-compression bonding technology to suppr...
关键词：thermo-compression bonding Cu-Au bonding contact interface laser scattering force 
Coordinated Regulation of Bonding Interfacial Structure and Mechanical Properties of Al/Mg Alloy Composite Plates by Electrically Assisted Rolling
《Chinese Journal of Mechanical Engineering》2025年第1期246-260,共15页Tingting Zhang Xingrun An Yan Wang Gongbo Bian Tao Wang 
Supported by National Natural Science Foundation of China(Grant Nos.52075360,52275360,51805359).
Current research on the fabrication of rolled composite plates primarily focuses on processing and bonding mechanisms.Compared with hot-rolling technology,the electrically assisted rolling process has demonstrated exc...
关键词：Al/Mg alloy composite plate Electrically assisted rolling Bonding properties Interfacial structure 
Synergistic effect of bonding heterogeneity and phonon localization in introducing excellent thermoelectric properties in layered heteroanionic NdZnSbO material
《Journal of Energy Chemistry》2025年第1期259-272,共14页Da Wan Shuwei Tang Shulin Bai Xiaodong Li Peng Ai Wanrong Guo Tuo Zheng 
Financial supports from the National Natural Science Foundation of China(21503039);Department of Science and Technology of Liaoning Province(2019MS164);Department of Education of Liaoning Province(LJ2020JCL034);Discipline Innovation Team of Liaoning Technical University(LNTU20TD-16)are greatly acknowledged。
Layered rare-earth metal oxides,harnessing the dual properties of oxides and two-dimensional layered materials,exhibit remarkable thermal stability and quantum confinement effects.Therefore,this work adopts the first-...
关键词：Heteroanionic materials Multi-valley characteristics Four-phonon scattering Bonding heterogeneity Rattling-like behavior 
Lithium niobate electro-optical modulator based on ion-cut wafer scale heterogeneous bonding on patterned SOI wafers
《Photonics Research》2025年第1期106-112,共7页ZHUOYUN LI YANG CHEN SHUXIAO WANG FAN XU QIANG XU JIANMIN ZHANG QIANNAN ZHU WENCHENG YUE XIN OU YAN CAI MINGBIN YU 
China State Key Laboratory of Materials for Integrated Circuits(NKLJC-Z2023-A04);National Natural Science Foundation of China(62204250,61935003);National Key Research and Development Program of China(2021YFB2800303).
This paper presents the design,fabrication,and characterization of a high-performance heterogeneous silicon on insulator(SOI)/thin film lithium niobate(TFLN)electro-optical modulator based on wafer-scale direct bondin...
关键词：MODULATOR SOI INTERFEROMETER 
Tunable refractive index transparent conductive adhesives for efficient monolithic tandem solar cells
《Science Bulletin》2025年第2期144-147,共4页Xingliang Li Sanlong Wang Xiangqing Zhou Yucheng Li Hui Liu Biao Shi Qiang Sun Ying Zhao Xiaodan Zhang 
supported by the Joint Funds of the National Natural Science Foundation of China(U21A2072);the National Natural Science Foundation of China(62274099);the Overseas Expertise Introduction Project for Discipline Innovation of Higher Education of China(B16027);Tianjin Science and Technology Project(18ZXJMTG00220);the Key R&D Program of Hebei Province(19214301D);the Natural Science Foundation of Tianjin(20JCQNJC02070);China Postdoctoral Science Foundation(2020T130317,2020M680864,and 2021T140341);Haihe Laboratory of Sustainable Chemical Transformations,and the Fundamental Research Funds for the Central Universities,Nankai University。
Tandem solar cells(TSCs)such as III–V/silicon and perovskite/silicon TSCs hold the promise of overcoming the power conversion efficiency(PCE)limit of conventional single-junction solar cells[1–3].Direct growth and v...
关键词：BONDING VACUUM TRANSPARENT 
Software-defined process-near-memory architecture using 3D hybrid bonding integration
《Science China(Information Sciences)》2025年第1期363-375,共13页Anlin XU Chenchen DENG Jianfeng ZHU Yao WANG Shaojun WEI Leibo LIU 
supported by National Key R&D Program of China(Grant No.2021YFB3100903);Beijing Superstring Academy of Memory Technology;National Natural Science Foundation of China(Grant Nos.61834002,62104129,2022-XXXX-ZD-005-00).
With the unprecedented explosive growing amount of global data,the development of computing chips,which encounter bottlenecks such as power wall and memory wall,cannot satisfy the demanding requirement.This work propo...
关键词：software-defined chips process near memory energy efficiency dynamic reconfiguration domain specific 
A bright future for micro-LED displays
《Light(Science & Applications)》2024年第12期2877-2879,共3页Vineeth K.Bandari Oliver G.Schmidt 
The development of GaN-based Micro-LED arrays achieving brightnesses exceeding 10^(7)nits and high-density microdisplays with up to 1080×780 pixels marks a true breakthrough in the field.This breakthrough is a result...
关键词：BREAKTHROUGH EXCEEDING BONDING 
Manufacturing of high strength bimetallic section steel with hot-rolling process
《Progress in Natural Science:Materials International》2024年第6期1225-1235,共11页Zecheng Zhuang Lei Zeng Weiping Lu Xuehai Qian Zhen Li Jianping Tan Yong Xiang 
funded by the key R&D project of Guangxi Zhuang Autonomous Region(NO.2021AB16016);the Project of State Key Laboratory of Precision Manufacturing for Extreme Service Performance,Central South University(Grant No.ZZYJKT2024-10);the science and technology plan project of Liu Zhou City(NO.2021AA0101B001);Guangxi Science and Technology Normal University Key Laboratory project(NO.GXKSKYPT2021008);Guangxi Science and Technology Base and Talent Project(NO.AD23026282);Guangxi Higher Education Undergraduate Teaching Reform Project(NO.2023GKSYGB32)
This study aimed to develop a 316L/35#stainless steel–bimetallic section steel to satisfy plasticity and strength standards.The stainless steel bimetallic section was made of 316L stainless steel,whereas the base met...
关键词：Bimetallic section steel Multiple scales Metallurgy bonding STRENGTH Composite interface 
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