BCB在光电芯片制造中的工艺研究  

Research of BCB in Optical Chip Manufacturing Process

作　　者：钟行 王任凡 李林 阳红涛 

机构地区：[1]武汉电信器件有限公司,武汉430074

出　　处：《半导体技术》2012年第3期197-200,共4页Semiconductor Technology

摘　　要：BCB树脂具有良好的平坦化特性、电气特性和热稳定性,相比于聚酰亚胺等其他介质,它具有介电常数小,吸水率低,固化温度低和可靠性高等特点,可以用于进行沟槽填充。研究了一种采用BCB介质进行沟道填充的倒台结构脊波导激光器,并且优化了涂覆,固化以及刻蚀等工艺参数,与采用直台结构的脊波导激光器进行了性能对比,发现利用BCB介质进行沟道填充的芯片,具有更低的阈值电流,更小的串联电阻和热电阻,以及更高的斜率效率,各项技术参数均优于直台结构脊波导激光器。The benzocyc lobutene （BCB） resin is a media material used for the populated groove. It is with good planarization properties, electrical properties and thermal stabilities compared to other media materials like polyimide, besides it has small dielectric constant, low water absorption, low cure temperature and high reliability. An reversed-mesa structure optical chip was researched by using BCB to populate＇ groove. The parameters of coating, curing and etching were optimized. Moreover, the performance between the vertical-mesa structure and reversed-mesa structure was compared. The result shows that the waveguide lasers using the reversed-mesa structure have a lower threshold current, smaller series resistance and heat resistance, higher efficiency and better performance in all parameters compared to vertical-mesa structures.

关 键 词：苯并环丁烯 倒台 沟槽填充 涂覆 固化 等离子刻蚀 

分 类 号：TN405[电子电信—微电子学与固体电子学]