微量锗对Sn-0.7Cu-0.05Ni钎料微观组织与性能的影响  

Effects of trace Ge addition on the microstructure and properties of Sn-0.7Cu-0.05Ni solder alloy

作　　者：易江龙[1] 张宇鹏[1] 许磊[1] 刘师田[1] 杨永强[1] 

机构地区：[1]广州有色金属研究院焊接技术研究所,广东广州510651

出　　处：《电子元件与材料》2012年第3期49-52,共4页Electronic Components And Materials

基　　金：广东省中国科学院全面战略合作资助项目(No.2009B091300039);广州市天河区科技计划资助项目(No.095G108)

摘　　要：为改善Sn-0.7Cu-0.05Ni钎料抗氧化性差及溶铜速率快的问题,向Sn-0.7Cu-0.05Ni钎料中添加微量锗,研究了不同锗添加量（质量分数0.01%~0.10%）对SnCuNi钎料合金显微组织及性能的影响。结果表明,微量的锗能显著细化Sn-0.7Cu-0.05Ni钎料合金组织,抑制金属间化合物的生长,改善合金的组织分布,提高钎料的润湿性及力学性能。此外,锗的添加还能显著提高钎料的抗氧化性并降低溶铜速率,当锗的质量分数从0增至0.10%时,溶铜速率从0.117 m/s降至0.110 m/s。In order to solve the problem of the Sn-0.7Cu-0.05Ni solder alloy, such as the poor oxidation resistance and extra fast copper dissolution rate, various small amounts （mass fraction 0.01%-0.10%） of germanium were added into this alloy and their microstructure and properties were investigated. The results show that adding trace amount of germanium can refine the organization of the Sn-0.7Cu-0.05Ni solder alloy and inhibit the growth of intermetallic compound. Meanwhile, more uniform microstructure and improvements of the wettability and mechanical properties are obtained with germanium addition. Moreover, the addition of germanium can reduce the oxidation rate and the copper dissolution rate. The copper dissolution rate reduces from 0. 117μm/s to 0.110 μm/s when the mass fraction of germanium increases from 0 to 0.10%.

关 键 词：Sn-Cu-Ni 无铅钎料 锗 溶铜速率 

分 类 号：TG425[金属学及工艺—焊接]