碳掺杂对CrN镀层显微硬度与组织结构的影响  

Hardness Enhancement of CrN Coatings by C-Doping

作　　者：胡鹏飞[1] 蒋百灵[1] 李洪涛[1] 

机构地区：[1]西安理工大学材料科学与工程学院,西安710048

出　　处：《真空科学与技术学报》2012年第2期158-162,共5页Chinese Journal of Vacuum Science and Technology

基　　金：国家"863"科技攻关项目(2005AA33H010)

摘　　要：采用闭合场非平衡磁控溅射离子镀技术在单晶硅(111)衬底上沉积了CrCN镀层以研究C靶电流对镀层显微硬度的影响,并通过X射线衍射、原子力显微镜、X射线光电子能谱和透射电镜对镀层进行了分析。结果表明:当C靶电流由0增加到1.5 A时,镀层显微硬度由1930 HV增加到2300 HV,提高约19%,并且镀层的颗粒明显变小;X射线衍射和透射电镜分析表明,随着C靶电流增大,镀层由晶态向非晶态转变;X射线光电子能谱分析表明,镀层碳元素主要以sp2键、sp3键和C-Cr键的形式存在。The carbon-doped CrN coatings were deposited by closed-field unbalanced magnetron sputtering ion plating on silicon substrates.The impacts of the growth conditions on the microstructures and mechanical properties of the CrN coatings were characterized with X-ray diffraction,X-ray photoelectron spectroscopy,atomic force microscopy,transmission electron microscopy and conventional mechanical probes.The results show that the C-target current significantly affects the microstructures and mechanical properties of the coating,and that sp2,sp3 and Cr-C bonds dominate in the carbon bonding.As the current increases from 0 to 1.5 A,the micro-hardness of the coatings,with decreased grain size,increases by almost 19%,from 1930 HV to 2300 HV,and the current increase also resulted in a polycrystalline to amorphous phase transition.

关 键 词：磁控溅射 CrCN镀层 原子力显微镜 X射线衍射 X射线光电子能谱 

分 类 号：TG178[金属学及工艺—金属表面处理]