复合添加剂对次磷酸钠化学镀铜的影响  

Effect of Compound Additives on Electroless Copper Plating Using Sodium Hypophosphite as Reducing Agent

作　　者：贾玉蓉[1] 戴亚堂[1] 申振[1] 张欢[1] 周龙平[1] 李常雄[1] 

机构地区：[1]西南科技大学四川省非金属复合与功能材料重点实验室-省部共建国家重点实验室培育基地,四川绵阳621010

出　　处：《精细化工》2012年第3期294-298,共5页Fine Chemicals

基　　金：国家高技术研究发展计划(863计划)(2008AAxxx310);西南科技大学博士基金(08zx0101);西南科技大学研究生创新基金(10ycjj07)~~

摘　　要：在以次磷酸钠为还原剂的化学镀铜体系中,考察了2,2'-联吡啶/亚铁氰化钾复合添加剂对化学镀铜的影响。采用电化学方法分析了无添加剂、单一添加剂和复合添加剂对次磷酸钠氧化电势和电流的影响,结果表明,2,2'-联吡啶、亚铁氰化钾和2,2'-联吡啶/亚铁氰化钾复合添加剂均使次磷酸钠氧化电势增加,氧化电流减小。扫描电子显微镜(SEM)、能量色散谱(EDS)、X射线衍射(XRD)、四探针测试法(SZT-90)检测结果显示:较之单一添加剂,10 mg/L 2,2'-联吡啶/4 mg/L亚铁氰化钾复合添加剂所得铜镀层纯度更高〔w(Cu)=96.27%〕,外观更加光亮、致密和均匀,铜层表面平均电阻率也降低至0.022 9μΩ.m。The electroless copper plating was studied in a bath consisting of sodium hypophosphite as reducing agent,2,2＇-dipyridyl and K4Fe（CN）6 as additives. The effect of various additives on the deposits was systematically investigated in this paper. The electrochemical analysis shows that the oxidation potential was increased with the addition of 2,2＇-dipyridyl and KaFe（ CN）6 additives ,while the oxidation current was decreased. Furthermore,the deposits were characterized by means of scanning electron microscope （SEM）, energy dispersive spectroscopy （EDS）, X-ray diffraction （XRD） and four-probe method. Compared with single additive,the compound additive[10 mg/L 2,2＇-dipyridyl and 4 mg/L K4Fe（CN）6] brings about higher purity of deposit [ w （Cu） = 96. 27 % 3, and brighter and more compact deposit surface. In addition, the surface resistivity of the deposits was as low as 0.0229μΩ·m.

关 键 词：次磷酸钠 化学镀铜 复合添加剂 沉积速率 表面形貌 环氧树脂板 有机电化学与工业 

分 类 号：TQ153[化学工程—电化学工业]