铜基类金刚石膜功能梯度材料作为散热材料的研究  

Study on the thermal conductivity of diamond-like carbon functionally graded material on copper substrate

作　　者：王静[1] 刘贵昌[2] 李红玲[1] 侯保荣[1] 

机构地区：[1]中国科学院海洋研究所山东省腐蚀科学重点实验室,青岛266071 [2]大连理工大学化工与环境生命学部,大连116024

出　　处：《物理学报》2012年第5期472-478,共7页Acta Physica Sinica

摘　　要：随着电子技术、信息产业的发展,Cu在微型散热材料、电子封装材料上应用日益广泛.Cu在应用过程中存在强度低、易氧化、易磨损等缺点.采用等离子体复合沉积技术,在铜基体上制备了Ti/TiC/DLC功能梯度材料,改善铜基体与美金刚石(DLC)膜的结合力,强化了铜的机械性能.瞬态热反射法检测结果表明,DLC功能梯度材料不会影响铜基体的散热效果.In recent years, with the rapid development of electronic technology and digital network information, copper has increasing applications in micro-electronics, micro-electro-mechanical systems and Hi-tech materials. However copper has its material limitations. In particular, it has relatively low hardness, high oxidation and wear rate, which have severely restricted its widespread applications. In this paper, aiming at difficulties of copper applications, Ti/TiC/DLC has been proposed as functionally graded material to deposit on the copper substrate with plasma depositing method, which intensifies the adhesion between DLC film and copper substrate and improves the properties of copper. The maximal value of thermal conductivity of DLC film with optimized parameter of graded intermediate layer is 3.63 Wm-1.K-1, which enhances the heat transfer effect of copper substrate.

关 键 词：铜基体 类金刚石膜 梯度过渡层 热导率 

分 类 号：TB34[一般工业技术—材料科学与工程]