一维银线制备及其在导电胶中的应用  

Preparation and Application of 1D Silver Wires for Conductive Adhesives

作　　者：秦峻[1] 堵永国[1] 汪晓[2] 张为军[1] 刘阳[2] 

机构地区：[1]国防科技大学航天与材料工程学院,长沙410073 [2]湖南有色中央研究院有限公司,长沙410073

出　　处：《贵金属》2012年第1期10-15,20,共7页Precious Metals

摘　　要：用不锈钢辅助醇热法高浓度、大规模制得低长径比(约为10～20)的一维银线,AgNO3浓度可达0.65 mol/L;该一维银线可作为导电胶的导电填料使用;一定范围内降低AgNO3浓度生成的一维银线其长度几乎保持不变,但平均直径略有减小;采用反应活性较低的不锈钢,提高初始反应温度对一维银线的形成有不利的影响。一维银线经球磨可制得类似带状的银粉;采用带状银粉制备的导电胶体积电阻率较一维银线更低,渗流阈值可以降至20%(质量分数)。The a stainless steel - assisted polyol method has been proposed for high - concentration and large -scale preparation of 1D silver wires with low aspect ratios（ 10 -20） at high AgNO3 concentrations of up to 0.65 mol/L. The 1D silver wires when used as conductive filler in conductive adhesives are easy to pass through screen printing forme. The average diameter of 1 D silver wires increases somewhat with the concentration of AgNO3 while the length of 1 D silver wires almost remains unchanged. Silver belts were prepared from 1D silver wires by a ball - milling process. The bulk resistivity and percolation threshold of conductive adhesives with silver belts as conductive filler are lower than 1 D silver wires in the same filler content and its percolation threshold can be lower than 20wt%.

关 键 词：金属材料 一维银线 醇热法 导电胶 带状银粉 

分 类 号：TM24[一般工业技术—材料科学与工程]