乙醛酸化学镀铜工艺  

An Electroless Copper Plating Process Using Glyoxylate as Reductant

作　　者：杨防祖[1] 姚光华[1] 周绍民[1] 

机构地区：[1]厦门大学化学化工学院固体表面物理化学国家重点实验室,福建厦门361005

出　　处：《电镀与精饰》2012年第3期1-5,共5页Plating & Finishing

基　　金：国家自然科学基金(20873114;20833005);国家重点基础研究发展规划项目(973)(2009CB930703)

摘　　要：研究了以乙醛酸为还原剂的化学镀铜工艺、镀层结构和形貌。其镀液组成和操作条件为:28.0 g/L CuSO4.5H2O,44.0 g/L EDTA-2Na,10.0 mg/Lα,α'-联吡啶,10.0 mg/L亚铁氰化钾,9.2 g/L乙醛酸,pH为11.5～12.5,θ为40～50℃。实验结果表明,化学镀铜溶液较稳定;镀液温度和硫酸铜质量浓度提高,铜沉积速率增大;较高的镀液温度下,化学镀铜反应的活化能较低,镀液稳定性下降;镀液pH在11.5～12.5可获得较好的铜镀层;随乙醛酸和络合剂质量浓度提高,铜沉积速率变化不大,但过量的乙醛酸导致镀液的稳定性降低;铜镀层为面心立方混晶结构,呈光亮的粉红色块状形貌,有较高的韧性。An electroless copper plating process using glyoxylate as reductant was developed,structure and surface morphology of the deposit were also studied.The bath composition and operating conditions were：28.0 g/L CuSO4 · 5H2O,44.0 g/L EDTA · 2Na,10.0 mg/L α,α＇-bipyridyl,10.0 mg/L potassium ferrocyanide,9.2 g/L glyoxylate,pH 11.5~12.5,temperature 40~50 ℃.Experimental results showed that：the electroless copper plating bath was quite stable;the copper deposition rate would increased in case of bath temperature and copper sulfate concentration increased;the bath stability would decreased due to lower activation energy of copper deposition in case of higher temperature;the qualified copper coating could be obtained only at a proper bath pH range of 11.5~12.5;the copper deposition rate would not be affected by concentrations of glyoxylate and complexing agent evidently,whereas excessive content of glyoxylate would cause the bath stability decreased;the copper coating had a FCC mixed crystal structure with blocky grains、pink/bright appearance and good ductility.

关 键 词：化学镀铜 乙醛酸 镀液稳定性 

分 类 号：TQ153.14[化学工程—电化学工业]