潜伏性热释放型微胶囊固化剂2苯基咪唑-聚甲基丙烯酸缩水甘油酯的结构表征与性能研究  

Preparation and Performance Study of Heat Released Microcapsule-type Latent Curing Agent 2PZ-PGMA

作　　者：史有强[1] 张秋禹[1] 马爱洁[1] 尹常杰[1] 

机构地区：[1]西北工业大学理学院,西安710072

出　　处：《化学通报》2012年第3期245-250,共6页Chemistry

基　　金：国家自然科学基金项目(50773063);国家973计划项目(2010CB635111);西北工业大学基础研究基金项目(G9KY1020)资助

摘　　要：以2-苯基咪唑(2PZ)为芯材,聚甲基丙烯酸缩水甘油酯(PGMA)为壁材,采用溶剂挥发技术,成功地制备了一种新型潜伏性热释放型微胶囊固化剂2PZ-PGMA。通过FT-IR、TGA、SEM、粒度分析和DSC对微胶囊固化剂的化学结构、芯材含量、表面形貌、粒径分布及固化性能等进行了表征。所制备的微胶囊固化剂表面光滑,粒径分布较窄,平均粒径为约17.6μm,壁材厚度为约1.1μm,芯材2PZ含量为20.1(wt)%。由微胶囊固化剂与环氧树脂E-51制备的单组分胶粘剂,具有优良的固化特性、潜伏性能和粘接性能,可在100℃下30min内实现固化,室温储存期达33d以上,拉伸剪切强度达15.36MPa。A novel heat released microcapsule-type latent curing agent was successfully prepared by solvent evaporation technique with 2-phenylimidazole （2PZ） as core material and polyglycidyl methacrylete （PGMA） as wall material. The chemical structure, core material content, surface morphology, size distribution and curing characteristics of as-prepared microcapsule-type curing agent were characterized by FT-IR, TGA, SEM, granulometer and DSC. The microcapsules had a smooth surface and displayed a narrow size distribution with the mean size of 17. 6μm, and their wall thickness was about 1.1μm with core material content about 20. 1 （wt） %. In addition, the one-component adhesive made from the microcapsules and epoxy resin E-51 showed advanced curing characteristics, latent properties and bonding performance. The E-51/PGMA microcapsule system can be cured at 100℃ in 30rain and its shelf life at room temperature is more than 33 days with its tensile shear strength about 15.36MPa.

关 键 词：微胶囊 潜伏性固化剂 单组分胶粘剂 溶剂挥发法 

分 类 号：O633.5[理学—高分子化学]