导热有机硅封装胶的研究进展  

Advancement of thermal conductivity silicone encapsulation

作　　者：裴昌龙[1] 陈清[1] 钟桂云[1] 陶杰[1] 邵均林[1] 

机构地区：[1]浙江省化工研究院有限公司,杭州310023

出　　处：《化工新型材料》2012年第3期1-3,17,共4页New Chemical Materials

摘　　要：根据导热有机硅封装胶的研发要求,着重介绍了近年来国内外为提高导热有机硅封装胶的耐老化性、导热性、力学性能等方面的最新研究成果,并对有机硅封装胶研发过程中的难点进行了分析,认为寻求高导热填料以及开发新型耐高温有机硅基体材料是导热有机硅封装胶的研发关键。With the development of photoconducting technology and device produces more heat,there is new requirement of thermal conductivity encapsulation material.The conductive encapsulated silicone was introduced.The research of aging mechanism of silicone,thermal conductive,mechanical properties and encapsulation technology were also expatiated,it analyzed the difficulties during the research.The key of research and development was to seek high thermal conductivity fillers and synthetize novel high temperature resistance silicone material.

关 键 词：有机硅 胶粘剂 导热性 封装 

分 类 号：TQ436.6[化学工程]