微量铅对Sn-9Zn钎料组织及性能的影响  

Effect of Trace Pb on Microstructure and Property of Sn-9Zn Solder

作　　者：吴敏[1] 

机构地区：[1]辽宁石油化工大学机械工程学院,辽宁抚顺113001

出　　处：《石油化工高等学校学报》2012年第1期66-70,共5页Journal of Petrochemical Universities

基　　金：辽宁省教育厅科学研究计划资助项目(2008382;20060505)

摘　　要：微量铅在目前的无铅工艺生产制程中广泛存在,并可对无铅钎料组织性能产生重要影响。运用X射线衍射仪、扫描电镜及电化学测试系统等仪器设备,研究微量铅对Sn-9Zn钎料组织性能影响。结果表明:当Pb质量分数为0.3%时,Sn-9Zn钎料中富Zn相明显细化,Pb固溶于钎料中;当Pb质量分数为0.8%时,钎料组织得到细化,Pb还以单质形式存在晶界处;钎料润湿性随Pb含量增加而得到改善,钎料显微硬度随Pb含量增加而增加,钎料腐蚀电位随Pb含量增加略有增大,但腐蚀电流密度却随Pb含量增加而明显减小。Trace Pb existing in widespread lead-free soldering manufacturing Currently,may impact on microstructure and property of lead free solder.Effect of trace Pb on microstructure and property of Sn-9Zn solder was investigated by means of XRD,SEM and electrochemical testing system etc.The results show that Zn-rich phase in Sn-9Zn solder significantly refine and Pb is solube in the solder at Pb content of 0.3%;microstructure remarkablely is refine at Pb content of 0.8%,and Pb precipitate in grain boundaries as well;wettability and microhardness of the solder increase with Pb content increasing,corrosion potential rise a little with Pb content increasing,however,corrosion current density decrease significantly with increasing Pb content.

关 键 词：金属材料 锡合金 无铅钎料 铅 SN-9ZN钎料 组织 性能 

分 类 号：TE980[石油与天然气工程—石油机械设备] TG42[金属学及工艺—焊接]