微型种子源焊封技术研究  

Sealing of ^(125)I sources in titanium capsules

作　　者：何佳恒[1] 秦传洲[1] 钟文彬[1] 马宗平[1] 徐建[1] 钟正坤[1] 

机构地区：[1]中国工程物理研究院核物理与化学研究所,四川绵阳621900

出　　处：《焊接技术》2012年第3期6-8,1,共3页Welding Technology

基　　金：中国工程物理研究院军民两用基金资助项目(JM200909);中国工程物理研究院科学技术发展基金资助项目(2009B0301028)

摘　　要：对125I种子源源芯的焊封作了考察,研究了保护气、激光耦合器与焊接件顶端的距离、脉宽、输出功率等参数对焊接的影响,获得了激光焊接焊封微型钛管的参数。在优化的工艺参数下,能获得密封性好的种子源,漏率量级为10-10和10-11,在国标允许的范围内。In this paper,the welding of source core had been investigated.The distance between laser coupling facility and the top of welding piece,the influence of parameters such as protective gas,impulse width and output power onto welding were studied,so as to obtain parameters for welding mini-titanium tubes using laser.According to optimal technical parameters,the well-sealed seed source could be gained,whose leakage grade was 10-10 and 10-11 allowed in national standard.

关 键 词：125I 种子源 封装 

分 类 号：TG456.7[金属学及工艺—焊接] TL929[核科学技术—核燃料循环与材料]