LTCC电路基板上金丝热超声楔焊正交试验分析  

Analysis of Orthogonal Test for Thermo-sonic Wedge Bonding on LTCC Circuit Board

作　　者：金家富[1] 胡骏[1] 

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽合肥230088

出　　处：《电子工艺技术》2012年第2期99-101,共3页Electronics Process Technology

摘　　要：进行了LTCC基板上金丝热超声楔焊的正交试验,在热台温度和劈刀安装长度等条件不变的情况下,分别设置第一键合点和第二键合点的超声功率、超声时间和键合力三因素水平,试验结果表明第一点超声功率和第二点超声时间对键合强度影响明显。The orthogonal test for thermo-sonic wedge bonding on LTCC circuit board is discussed. Ultrasonic power, ultrasonic time and bonding force parameters are given for the first bond and the second bond by holding the temperature of heater and length of capillary. Ultrasonic power for first bond and ultrasonic time for second bond are effective for wire bonding strength by the experiment.

关 键 词：正交试验 金丝 热超声楔焊 

分 类 号：TN305[电子电信—物理电子学]