电子系统热管理设计与验证中的结温估算与测量  

Junction temperature evaluation and measurement in an electronic system's thermal management

作　　者：石秦[1] 曹宗生[1] 龙威[1] 宋立新[1] 孟广国 

机构地区：[1]北京广利核系统工程有限公司,北京100094

出　　处：《电子设计工程》2012年第6期162-165,共4页Electronic Design Engineering

摘　　要：针对电子系统容易出现的热失效问题,论述在电子系统的热管理设计与验证中,对半导体器件结温的估算和测量方法。通过测量半导体器件内部二极管参数,来绘制二极管正向压降与其温度关系曲线,进而求解出器件的结温估算值,以指导热管理设计;采用热分布测量和极值测量来计算器件的实际结温,对热管理设计进行评估、验证。使用所述估算和测量方法,可到达±5%精确度的半导体结温测算,能够有效评估器件在特定电子系统中的热可靠性,为实现可靠热管理提供可信的数据分析基础。Aim at thermal failure in many electronic systems ,methods of evaluating and measuring semiconductor＇s junction temperature in thermal management in design of an electronic system is presented. Via measuring parameter of a diode inside a semiconductor,forward voltage-temperature curves of the diode can be drawn. Therefore the junction temperature of the semicon- ductor can be calculated approximately,which can guide thermal management and design. Utilizing distributing thermal measurement and maximum measurement to calculate the junction temperature precisely ,thus to evaluate the thermal management. By using the methods,up to ±5% precision junction temperature can be achieved,so the reliability of a specific electronic system can be evaluated ,meanwhile the data basis have been applied for the thermal management analyzing of the system.

关 键 词：热管理 热设计 结温 热阻 功耗 可靠性 

分 类 号：TN306[电子电信—物理电子学]