磁控溅射Cu-Nb和Cu-Mo薄膜结构与性能  

Structures and Properties of Cu-Nb and Cu-Mo Thin Films Deposited by Magnetron Sputtering

作　　者：刘国涛[1,2] 孙勇[1,2] 郭中正[1,2] 吴大平[1,2] 朱雪婷[1,2] 

机构地区：[1]昆明理工大学稀贵及有色金属先进材料教育部重点实验室,昆明650093 [2]昆明理工大学材料科学与工程学院,昆明650093

出　　处：《材料导报》2012年第6期49-53,共5页Materials Reports

基　　金：云南省自然科学基金重点资助项目(2004E0004Z);国家863计划(2009AA03Z512);稀贵及有色金属先进材料教育部重点实验室开放研究项目(ZDS201012B)

摘　　要：采用磁控溅射制备含1.16%～15.8%(原子分数)Nb的Cu-Nb及含2.2%～27.8%Mo的Cu-Mo合金薄膜,井采用EDX、XRD、SEM、显微硬度仪和电阻计对薄膜的成分、结构和性能进行研究。结果表明,Nb和Mo的添加分别使Cu-Nb及Cu-Mo薄膜晶粒显著细化,Cu-Nb和Cu-Mo薄膜呈纳米晶结构,存在Nb在Cu中的fcc Cu(Nb)和Mo在Cu中的fcc Cu(Mo)非平衡亚稳过饱和固溶体,固溶度随Nb或Mo含量增加而上升。添加Nb和Mo显著提高Cu-Nb及Cu-Mo薄膜的显微硬度和电阻率,且随Nb或Mo含量增加而升高。经650℃热处理1h后,Cu-Nb和Cu-Mo薄膜显微硬度和电阻率均下降,且分析表明均发生基体相晶粒长大,并出现微米-亚微米级富Cu第二相,Cu-Nb及Cu-Mo薄膜结构和性能形成及演变的主要原因是添加的Nb、Mo引起的晶粒细化效应以及退火中基体相晶粒度的增大。Cu-Nb alloy thin films with 1.16% -15.8%Nb and Cu-Mo alloy thin films with 2. 2%-27. 8%Mo were prepared by magnetron sputtering. The compositions, structures and properties of thin films were investigated by EDX, XRD, SEM, microhardness instrument and resistivity meter. The results showed that the grain size of Cu- Nb and Cu-Mo alloy thin films were refined by Nb and Mo addition, respectively. Cu-Nb and Cu-Mo thin films pos- sessed nanocrystalline structure with the presence of fee Cu（Nb） and fcc Cu（Mo） non-equilibrium metastable supersa- turated solid solution, the solubility increased with the incremental Nb and Mo concentration. The microhardness and electrical resistivity of Cu-Nb and Cu-Mo thin films significantly increased by adding Nb and Mo, and both of them were improved with the increase of Nb and Mo content. The microhardness and resistivity of Cu-Nb and Cu-Mo de- creased after heat-treament at 650＂C for lb. Analysis revealed a coarseness in the grain sizes of the matrix phases of Cu-Nb and Cu-Mo films and the appearance of micron-submicron Cu-rieh second-phase. The formation and evolution of the mierostrueture and the properties of Cu-Nb and Cu-Mo thin films could be mainly attributed to the grain refining effect caused by Nb and Mo addition as well as the growth of matrix phases grain sizes in annealing process.

关 键 词：Cu-Nb合金薄膜Cu-Mo合金薄膜纳米晶结构热处理显微硬度 电阻率 

分 类 号：TB43[一般工业技术] TG146.411[一般工业技术—材料科学与工程]