基于双目标成像技术的BGA自动贴装系统设计  

Design of BGA Automatic SMD Soldering System Based on Dual-target Imaging Technique

作　　者：赵丽花[1] 谢永华[1] 

机构地区：[1]东北林业大学机电工程学院,黑龙江哈尔滨150040

出　　处：《现代科学仪器》2012年第1期51-54,共4页Modern Scientific Instruments

基　　金：中央高校基本科研业务费专项资金资助(41401021)

摘　　要：针对BGA芯片的特点,设计了基于双目标成像技术的自动贴装系统,介绍了单CCD视觉系统的构成及双目成像原理,避免了因多CCD之间的标定而引入的误差,介绍了整个系统的标定方法及标定过程,设计了自动贴装机的伺服控制系统,设计了双目图像的位置误差处理及对准流程,实现了双目成像系统的三维视觉功能,使系统实现高速贴装。According to the specialty of BGA chip,BGA automatic placement system based on binocular imaging technology was designed.It describes the binocular imaging system of composition and theory,avoiding a multi-CCD calibration between the introduction of errors.This paper studies the overall system calibration and designs the related image processing algorithms for the characteristics of the GBA chip to achieve three-dimensional visual features of a binocular imaging system.The algorithms can make the system achieve high-speed placement.

关 键 词：BGA芯片 双目成像 图像处理 

分 类 号：TN05[电子电信—物理电子学]