化学镀Ni-Cu-P合金工艺研究  

STUDY OF TECHNOLOGY OF ELECTROLESS PLATING OF Ni-Cu-P ALLOY

作　　者：叶栩青[1] 罗守福[1] 王永瑞[1] 

机构地区：[1]上海交通大学,上海200030

出　　处：《腐蚀与防护》2000年第3期126-128,139,共4页Corrosion & Protection

摘　　要：通过实验数据及图表论述了化学镀 Ni- Cu- P的工艺条件 ,探讨了镀液的主要组成成分、镀液的 p H值、施镀时间对镀层中 Ni、Cu、P质量百分含量、镀层的沉积速度的影响 。Technology of electroless plating of Ni Cu P alloy was investigated through a great deal of experiments. Influence of components and pH of the bath and plating time on the percentage content of Ni Cu P in the coating and the deposition rate of the alloy were discussed and tendency of coating components with changing technology paraments was summarised.

关 键 词：化学镀 镀层 成分 工艺 电镀 镀合金 镍铜磷合金 

分 类 号：TQ153.2[化学工程—电化学工业]