镁合金直接化学镀镍活化表面状态对镀速的影响  

Effect of Surface State after Activation on Deposition Rate of Direct Electroless Nickle Plating on Magnesium Alloy

作　　者：向阳辉[1] 胡文彬[1] 沈彬[1] 赵昌正[1] 丁文江[1] 

机构地区：[1]上海交通大学金属基复合材料国家重点实验室,上海200030

出　　处：《电镀与环保》2000年第2期21-23,共3页Electroplating & Pollution Control

摘　　要：研究了镁合金直接化学镀镍活化后表面状态对镀速的影响,结果表明,活化后表面FO比值较小时,镀速较快。这种现象与氧化镁在镀液中的溶解造成较多的基底与镀液中镍离子的置换反应有关。Effects of surface state after activation on deposition rate of direct electroless nickle plating on magnesium alloy are investigated. Reuslts show deposition rate is higher with lower F/O ratio of activated surface, which is related to magnesium oxide dissolution into plating bath and displacement reaction between substrate and nickle ions in bath.

关 键 词：化学镀 镁合金 活化 镀速 镀镍 电镀 

分 类 号：TQ153.12[化学工程—电化学工业]