活性氧化铜粉的工艺条件研究  

Process conditions research on the active copper oxide powder

作　　者：符飞燕[1] 王龙彪[1] 周仲承[1] 杨盟辉[1] 

机构地区：[1]中国人民解放军61699部队

出　　处：《印制电路信息》2012年第5期23-25,65,共4页Printed Circuit Information

摘　　要：研究开发了一条由纯铜片制备电镀级活性氧化铜粉的工艺方法。以铜片为原料,经过碳酸氢铵和氨水溶铜,常压脱氨,焙烧三阶段得到活性氧化铜粉。用SEM、ICP等方法对所得的活性氧化铜粉的性能进行了表征,结果表明,采用该法得到的活性氧化铜粉纯度达到99%以上,金属杂质含量和溶解速度完全符合电镀级氧化铜粉的要求,可以直接用到线路板的电镀工序。This work developed a technique to prepare active copper oxide powder at electroplating grade from pure copper piece.It was produced by three steps： firstly,the pure copper was dissolved in solutions of ammonium bicarbonate and ammonia,then the ammonia was removed at atmospheric pressure,and finally the residue was roasted in reactor.The produced active copper oxide powder was characterized by SEM and ICP.The results show that the purity of the powder is above 99%,the impurity content of metal and dissolution rate is accord with the requirement of electroplating grade.It can be used directly to the process of electroplating for circuit board.

关 键 词：活性氧化铜 不溶性阳极 水平电镀 酸性镀铜 印制电路板 

分 类 号：TN41[电子电信—微电子学与固体电子学]