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作 者:沈叔涛
出 处:《红外与激光工程》2012年第4期936-941,共6页Infrared and Laser Engineering
摘 要:微系统技术基于微机械加工技术以及集成电路工艺方法,具有微型化、集成化、智能化、成本低、性能高、可大批量生产等优点。概述了微系统的组成和工作原理,介绍了国内外微系统技术的历史、发展现状和产业分布格局,着重阐述了几种重要的微结构加工技术,分析了湿法刻蚀、干法深刻蚀、表面加工技术、键合、LIGA技术、纳米压印技术以及高深宽比制造技术的原理、各自特点以及制造工艺手段,并结合目前微型器件的产品应用分析了各种技术的优势,对于微系统技术的研究具有一定价值。Microsystem is a comprehensive course based on Micro-Electro-Mechanical Systems,manufacturing technology of integrated circuit and other sciences,which is minitype,integrated,intelligent,inexpensive,efficient and productive.The composing and principle on microsystem domestic and oversea were described,the history and status on development of microsystem and distribution of industry were also introduced.Kinds of significant technologies on the machining of micro-structure instrument were presented and the principle,characteristic and technic in wet-etching,deep dry-etching,surface processing,binding,LIGA technology,nanoimprint technology and technology of producting high aspect ratio structures(HARPSS) were analyzed.HARPSS can make devices three-dimensional.Extraordinarily LIGA,which utilizes the excellent permeability of X-ray,can make high aspect ratio greater than 200:1,so that the size of structures can be smaller.The advantages of every technology combined with typical micro device were also pointed out such as mini-capacitor microphone and gear wheel.
关 键 词:微系统 固体微加工 表面微加工 LIGA技术 高深宽比结构制造技术
分 类 号:TN405[电子电信—微电子学与固体电子学]
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