Tunable Reactive Wetting of Sn on Microporous Cu Layer  

作　　者：Qingquan Lai Lei Zhang Cai Chen J.K.Shang 

机构地区：[1]Shenyang National Laboratory for Materials Science,Institute of Metal Research,Chinese Academy of Sciences,Shenyang110016,China

出　　处：《Journal of Materials Science & Technology》2012年第4期379-384,共6页材料科学技术（英文版）

基　　金：supported by the National Natural Science Foundation of China (Grant No. 50501022);the National Basic Research Program of China (Grant No.2010CB631006)

摘　　要：Wetting of microporous Cu layer by liquid Sn resulted in contact angles from 0 to 33 deg., tunable by varying wetting temperature and porous microstructure. The wetting was dominated by the interracial metallurgical reaction, which can lead to pore closure phenomenon, as the liquid infiltration facilitating the wetting process.Wetting of microporous Cu layer by liquid Sn resulted in contact angles from 0 to 33 deg., tunable by varying wetting temperature and porous microstructure. The wetting was dominated by the interracial metallurgical reaction, which can lead to pore closure phenomenon, as the liquid infiltration facilitating the wetting process.

关 键 词：WETTING Porous material SOLDERING 

分 类 号：TG454[金属学及工艺—焊接] TG52