基于ANSYS Workbench的电子封装QFP热分析  

QFP Thermal Analysis Based on ANSYS Workbench

作　　者：袁金鹏[1] 贾育秦[1] 曾志迎[1] 闵学习[1] 

机构地区：[1]太原科技大学,山西太原030024

出　　处：《机械工程与自动化》2012年第3期152-153,共2页Mechanical Engineering & Automation

摘　　要：电子产品在工作过程中会产生大量的热,可靠的热分析在电子产品设计中必不可少。运用ANSYS Workbench对电子封装QFP结构进行热分析,得到电子封装系统的温度云图,并提出了提高QFP散热率的方法。Electronic products will produce a lot of heat during work. The reliable thermal analysis is necessary in electronic product design. In this paper, a thermal analysis of electronic packaging QFP was carried out by use of ANSYS Workbench,the temperature cloud chart was gained. And some ways to improve the heat dissipating rate of QFP were proposed.

关 键 词：热分析 ANSYS WORKBENCH QFP 

分 类 号：TP273[自动化与计算机技术—检测技术与自动化装置]