BaO含量对一种微电子封装材料性能的影响  

Effect of BaO Content on the Properties of a Kind of Microelectronic Packaging Materials

作　　者：于东英[1] 聂永峰[1] 邓新峰[1] 

机构地区：[1]电子科技大学电子薄膜与集成器件国家重点实验室,四川成都610054

出　　处：《压电与声光》2012年第3期438-441,共4页Piezoelectrics & Acoustooptics

摘　　要：采用传统固相反应法,制备了一种微电子封装材料,并对其进行了电、力、热性能测试,及XRD、SEM分析表征,具体研究了BaO含量对该材料性能的影响。结果表明:BaO对主晶相石英没有太大的影响,促进钡长石的形成,抑制方石英相的析出,其含量增加能在一定程度上改善材料的介电性能,但会逐渐破坏玻璃网络,影响到材料的力学和热学性能,导致抗弯强度降低,热膨胀系数减小。A kind of microelectronic packaging materials were prepared by traditional solid-state reaction method. The thermal,mechanic and electric properties were measured and the phase and mierostrueture evolution of the materials were characterized by XRD and SEM. The effect of BaO content on the properties of materials has been studied. The results showed that BaO didn＇t influence the main phase of quartz so much,but it could promote the formation of BaO·AllO3· 2SiO2 and inhibit the precipitation of the cristobalite phase. Increasing the content of BaO could improve the dielectric properties of materials to a certain extent. However, the glass network would be gradually destroyed, affecting the mechanical and thermal properties and resulting in the bending strength reduction as well as the thermal expansion coefficient decrease.

关 键 词：微电子 封装材料 石英 方石英 抗弯强度 热膨胀系数 

分 类 号：TN305.94[电子电信—物理电子学]