化学镀法制备铜包覆SiC颗粒的研究  

Study on the Preparation of Cu-coated SiC Particles by Electroless Plating

作　　者：赵丹[1] 宋红章[1] 孙洪巍[1] 胡行[1] 杨德林[1] 

机构地区：[1]郑州大学物理工程学院,郑州450052

出　　处：《表面技术》2012年第3期105-108,129,共5页Surface Technology

摘　　要：采用化学镀法制备了镀铜SiC粉体,研究了预处理、镀液成分、pH值和装载量对SiC化学镀铜的影响,并比较了主盐含量和装载量对复合粉体中铜含量变化的影响。利用XRD,SEM和EDS对粉体的物相、形貌、成分进行了分析,得到了最佳施镀工艺。结果表明:用于预处理的活化敏化液要放置一段时间后使用,才能成功地实施化学镀铜;随着pH值和主盐含量的升高,镀速呈上升趋势,但粉体的包覆完整性和均一性下降;通过改变装载量来控制复合粉体中的铜含量可行。Copper coated SiC particles were prepared by the electroless plating method. The influence of pretreatment, the plating solution component, the pH value and loadage on the Cu layer were analyzed. Furthermore, the effects of adjusting the content of sulfate and the loadage on controlling the copper content in the composite powder were compared. The phase, morphology and component of powder were analyzed with XRD, SEM and EDS to obtain the op timum plating process. The results show that the uniform Cu coat can be obtained only when the activating solution for pretreatment deposited for some time; Along with the pH value and the sulfate content increases, the speed of plating increases, but the cladding perfection and uniformity of powder reduces; Adjusting the loadage is a better way to control the content of copper in composite powder.

关 键 词：化学镀铜 SIC颗粒 预处理 镀速 铜含量 

分 类 号：TQ153.1[化学工程—电化学工业]