LED的COB封装热仿真设计  

Thermal Simulation for Design of LED COB Package

作　　者：兰海[1,2] 邓种华[1] 刘著光[1] 黄集权[1] 曹永革[1] 

机构地区：[1]中国科学院福建物质结构研究所,福建福州350002 [2]中国科学院研究生院,北京100039

出　　处：《发光学报》2012年第5期535-539,共5页Chinese Journal of Luminescence

基　　金：中国科学院院地合作项目(DBSH-0211-024);中国科学院重要方向性项目(KJCX2-EW-H07);福建省重大专项(2010HZ0005-2)资助项目

摘　　要：通过对COB封装中常用的陶瓷基板和金属基板这两类不同的基板材料进行有限元热仿真模拟,获得各自芯片到基板的仿真热阻,再使用红外热成像仪得到两种基板各自的表面温度分布情况并计算出实际热阻。仿真热阻与实际热阻的一致性表明了所采用的仿真计算方法的可用性。利用有限元仿真对COB封装的热管理方案进行了优化分析。研究表明:相对于金属基板,陶瓷基板由于无绝缘层这一散热瓶颈,其芯片到基板的热阻值约为金属基板封装方案的1/2;而且陶瓷基板有着更大的热管理优化空间,能更好地满足大功率LED封装的散热需要。Two typical types of substrate materials,i.e.,ceramic substrates without insulating layer and metal substrate with insulating layer were studied for the thermal management of COB package.Their chip-to-substrate thermal resistances were simulated and calculated by finite element method.Temperature distribution in two substrates was obtained by infrared thermography,which confirmed the adopted finite element method is feasible in our experiment.Based on these studies,the thermal management of COB package was optimized by finite element simulation.The results show that the ceramic substrate has a lower chip-to-substrate thermal resistance（only half of that of the metal substrate）,which indicate that it is more suitable for the heat dissipation in high-power LED package.

关 键 词：COB封装 有限元分析 热仿真 

分 类 号：TN312.8[电子电信—物理电子学]