用作超大规模集成电路低k材料的有机薄膜  

Organic films Used as low k dielectric materialin VLSI technology

作　　者：王鹏飞[1] 张卫[1] 王季陶[1] 李伟 

机构地区：[1]复旦大学电子工程系,上海200433 [2]台湾集成电路公司

出　　处：《微电子技术》2000年第1期31-36,共6页Microelectronic Technology

摘　　要：详细介绍了几种可用于超大规模集成电路的低介电常数有机薄膜材料 ,比如聚酰亚胺类有机薄膜、聚对二甲苯类有机薄膜和聚烯链类有机薄膜。比较了这几种薄膜之间的特性和制备工艺 ,并就薄膜的结构和制备方法对性能的影响做了进一步的探讨。Several organic films such as PI、parylene-N and polyene film with low dielectric constant are introduced in detail,the characteristics of these films and the processes of their preparation are compared,and influences of the structure and processing of films on its properties are also discussed further.

关 键 词：低K材料 集成电路 VLSI 有机薄膜 

分 类 号：TN304.055[电子电信—物理电子学]