微波多层电路通孔电磁特性混合分析方法  

Hybrid Analysis for Electromagnetic Characteristics of Through Vias in Microwave Multilayer Circuits

作　　者：田雨[1] 童玲[1] 李海良[1] 

机构地区：[1]电子科技大学自动化工程学院,成都611731

出　　处：《电子科技大学学报》2012年第3期392-396,共5页Journal of University of Electronic Science and Technology of China

基　　金：部级预研基金

摘　　要：通过对通孔结构物理建模,将其划分为外部结构和内部结构,针对其不同特点分别使用改进矩阵束矩量法和考虑平行板效应的等效电路法进行分析,根据微波网络级联的方法,可以获得反映完整通孔特性的散射参数。与商用软件HFSS的仿真结果对比,验证了不同边界条件下混合分析方法计算通孔散射参数的正确性。由于混合分析方法结合了场分析方法和路分析方法的优点,因此计算效率较商用仿真软件提高了5倍以上。The single through-via structure can be divided into two parts,interior structure and the exterior structure,based on physical modeling.The improved matrix-penciled moment method（MPMM） is applied to the analysis of the exterior structure.The equivalent circuit method which takes into account the parallel plate effect is applied to the analysis of the interior structure for structural features.The scattering parameters of the complete structure are obtained by the microwave network cascade theory.The hybrid analysis method is verified by comparing with the commercial simulation software HFSS in different boundary conditions.The computational efficiency of the hybrid analysis method is improved five times faster than that of the commercial simulation software benefitting from the combination of the field analysis method and the circuit analysis method.

关 键 词：微波多层电路 矩阵束矩量法 平行板效应 通孔 

分 类 号：TP206[自动化与计算机技术—检测技术与自动化装置]