基于光力学的剪切散斑技术及其应用  

Shear speckle technology based on photodynamics and its application

作　　者：米红林[1] 

机构地区：[1]上海应用技术学院机械工程学院,上海201418

出　　处：《机械设计与制造》2012年第1期60-61,共2页Machinery Design & Manufacture

基　　金：上海市教育委员会一般项目(060Z028)

摘　　要：介绍一种用于测试离面位移导数场的电子剪切散斑法,并对其原理进行了详细阐述。采用电子剪切散斑法,对典型圆盘试件进行了机械载荷作用下实验,得到了表示离面位移导数的干涉图,最后作为实际工程应用,对塑封产品进行了热载荷作用下的无损检测,成功识别到了缺陷部位,结果以蝴蝶形图案显示。通过圆盘试件和塑封材料实验,表明电子剪切散斑技术的装备简单,操作方便,能够较为准确的确定缺陷部位和大小,是较为理想的无损检测技术。The electronic shear speckle interferometery（ESSPI）used to measured out-plate displacement derivative fields is introduced in it,which principle is discussed in detail.Then the electronic shear speckle interferometery is adopted to test typical circle specimen under different loads and interferometry patterns indicating derivation of out-plane displacement are obtained.At last,as an engineering application in practice,nondestructive test for plastic sealed materials are done subjected to thermal loads and deflect part of specimen is successfully identified by ESSPI technique,which results are displayed by butterfly shape patterns.It is shown from the experiments of circle specimen and plastic sealed material that the equipment is simple for the ESSPI and operation is convenience.At the same time,the position and size of the defected part can be determined by ESSPI,which is ideal nondestructive technique.

关 键 词：剪切散斑技术 无损检测 塑封材料 

分 类 号：TH16[机械工程—机械制造及自动化] O348.6[理学—固体力学]