光照模式和时间对树脂粘接剂微拉伸粘接强度的影响  

Effect of curing modes and light-cure times on microtensile bond strength of adhesives

作　　者：魏文佳[1] 孟翔峰[1] 黄政[2] 刘侠[1] 周峰[1] 

机构地区：[1]南京大学口腔医学院修复科,江苏南京210008 [2]南京大学口腔医学院口腔颌面外科,江苏南京210008

出　　处：《临床口腔医学杂志》2012年第6期373-375,共3页Journal of Clinical Stomatology

摘　　要：目的:评价光照模式和时间对树脂粘接剂微拉伸粘接强度的影响。方法:选取40颗完整的人磨牙,磨平牙冠,露出面牙本质,分成两组,分别涂布粘接剂one-step plus(OS)和clearfil-se-bond(SE)。根据粘接剂光照模式及时间的不同每组又分为4亚组(n=5),分别为传统光照模式(fast)和软启动光照模式(ramp):fast 10 s、fast 15 s、ramp 20 s和fast 20 s。牙本质面分层充填树脂,水储存1周,检测微拉伸强度,体视显微镜下观察断裂模式。采用多因素方差和LSD多重检验统计数据(α=0.05)。结果:OS组的fast 10 s、ramp 20 s和fast 20 s之间微拉伸强度无显著差异,fast 15 s显著低于ramp 20 s和fast 20 s组。SE组:fast 20 s>ramp 20 s>fast 10 s和fast 15 s,fast 20 s远高于其它各组。结论:在本实验中,软启动技术不能显著提高粘接剂的微拉伸粘接强度;传统光照20 s可显著提高clearfil-se-bond的微拉伸粘接强度;one-step plus的光照仍推荐为传统光照10 s。Objective： This in vitro study evaluated the effect of curing modes and light-cure times on microtensile bond strength of adhesives. Method： 40 extracted intact human molars were flattened to expose coronal dentin, and assigned into two groups, then prepared with one-step plus （OS）or clearfil-se-bond （SE）.According to curing modes and light-cure times of adhesives,each group was divided into four subgroups （n=5） ：fast 10 s,fast 15 s,ramp 20 s and fast 20 s.Then the prepared teeth were restored with resin composites incrementally, After one week of water-storage, they were tested for microtensile bond strength. The failure models of beams were observed under a stereomicroscope. Data were analyzed by two- way ANOVA and LSD test （a=0.05）. Result： In the OS group, there was no statistical difference between the microtensite bond strengths （μTBS） of fast 10 s,ramp 20 s and fast 20 s, and the μTBS of fast 15 s was significantly lower than those of ramp20s and fast 20 s. In the SE group, it was fast 20 s〉ramp 20 s〉fast 10 s and fast 15 s, and the μTBS of fast 20 s was far more higher than other subgroups. Conclusion： Within the limitations of this study, the soft-start technique could not improve μTBS of adhesives significantly. Being Cured in conventional curing model for 20 s can improve μTBS of clearfil-se- bond significantly, while one-step plus should be cured for 10 s in conventional cuing model.

关 键 词：光照模式 软启动 光照时间 树脂粘接剂 微拉伸粘接强度 

分 类 号：R783.5[医药卫生—口腔医学]