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机构地区:[1]常州大学材料科学与工程学院,常州213164 [2]复旦大学材料科学系,上海200433
出 处:《复旦学报(自然科学版)》2012年第2期231-235,265,共5页Journal of Fudan University:Natural Science
基 金:江苏省基础研究计划资助项目(BK2009570)
摘 要:采用乳液聚合法制备了壳为聚苯乙烯,核为分散有银纳米线的聚硫醇与二乙基苯胺(DMBA)的混合物的核壳结构纳米粒子.将这些纳米粒子分散在填充有银纳米线的各项同性导电胶(ICA)胶体中,在外界作用力下,这些纳米核壳结构粒子自动破裂,聚硫醇与DMBA的混合物与胶体中过量的环氧基团快速反应,自动修复受外力破坏产生的胶体微裂纹,同时核壳结构粒子中的银纳米线均匀分散在修复处,起到对导电网络的修复作用.研究了核壳结构粒子的填充量对导电胶力学及电学修复效果的影响.并对修复机理进行了阐述.Mierosized Polystyrene(PS)-Ag nanowires/Dimethylbenzylamine(DMBA)/Polythiol core-shell capsules were prepared by an emulsion polymerization method. A novel kind of self-healing isotropical conductive adhesive was developed by using these microeapsules as healing agents. When microcracks produced by outside force reached to these healing agents, the shell layer would be destroyed automatically and the healing agents in the core would release and react with access epoxy groups in resin substrates immediately, a new network would be formed again in bulk ICA, which has a healing effect for mechanical strength of ICA. On the other side, the dispersed Ag nanowires in microcapsules core also would release and fill in the broken area to set up a conductive network, which will help ICA to obtain a good or even better electrical properties. The relationship between the content of self-healing microeapsules and the healing efficiency was studied and the healing mechanism was described.
分 类 号:TB331[一般工业技术—材料科学与工程]
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