光电多芯片组件的自由空间光互连技术研究  

The Study of Free-space Optical Interconnection for OE MCM

作　　者：李珂[1] 来金梅[2] 黄培中[1] 

机构地区：[1]上海交通大学"区域光纤通信网与新型光通信系统"国家重点实验室,200030 [2]浙江大学信息与电子工程系,杭州310027

出　　处：《固体电子学研究与进展》2000年第1期94-98,共5页Research & Progress of SSE

摘　　要：自由空间光互连 (FSOI)技术使用激光在自由空间中传播 ,其表现出的特性如速度和功耗等方面较之电在连线中的传输具有的明显优点 ,从而在具有巨大发展潜力的光电多芯片组件(OE- MCM)中得到了广泛的重视。本文在建立了 OE- MCM的物理模型、逻辑模型及开销模型的基础上 ,着重对 OE- MCM中的互连分割、互连距离 (MID)最小化和 FSOI互连设计几个方面进行了研究。Free space optical interconnection(FSOI) uses laser light traveling in free space media instead of electricity traveling in wires as the media for communication. FSOI has shown the obvious advantages over electronic interconnection in many aspects, such as speed and power consumption. This paper presents a physical model of an optoelectronic multichip modules(OE MCM) package in transmisive configurations, a logical relationship model inside a general OE MCM system, and the cost model. Based on these models we study the partitioning of the total interconnects into optical and electronic interconnection, minimize the maximum interconnection distance(MID) and investigate the design for FSOI.

关 键 词：自由空间光互连 光电多芯片组件 光电集成电路 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]