HIC导带缺陷的电学检测与评估  

Electrical Test and Evaluation on the Conduction Band Defects of Hybrid Integrated Circuits

作　　者：韩孝勇[1] 

机构地区：[1]西安电子科技大学,西安710071

出　　处：《半导体技术》2000年第2期49-52,共4页Semiconductor Technology

摘　　要：介绍了通过测试混合集成电路导带的方块电阻、温度系数等电学特性 ,再经过高温存贮试验考核其质量的稳定性 ,对其质量和缺陷进行评估分析 ,探索导带质量缺陷与电学特性的关系 ,为宏观评价导带质量缺陷提供一个快捷的途径。In this paper,the property such as sheet resistance and temperature coefficient of conductor film has been tested.The samples have been passed through high temperature deposit to check the stability of its quality.The quality and defect have been analyzed and evaluated to explore its relations to the electrical property.This method is a shortcut to evaluate the quality of the electric connection bond of HIC.

关 键 词：混合集成电路 导带 缺陷 测试 

分 类 号：TN450.7[电子电信—微电子学与固体电子学]