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作 者:唐高峰[1] 杨传仁[1] 张继华[1] 陈宏伟[1] 赵强[1]
机构地区:[1]电子科技大学电子薄膜与集成器件国家重点实验室,四川成都610054
出 处:《物联网技术》2012年第6期53-55,共3页Internet of things technologies
摘 要:采用传统固相合成法制成的LSCO作为功能相,并用钙硼硅玻璃作为无机粘结相制备了厚膜电阻浆料。研究了玻璃相的含量、峰值烧结温度对厚膜方阻及电阻温度系数的影响。结果表明:当浆料固相成分中玻璃相的质量分数为3%~9%(体积分数为11.11%~28.56%)时,制备的厚膜电阻浆料方阻变化范围为1kΩ/□~10MkΩ/□。电阻温度系数为-8000×10-6/℃~-5000×10-6/℃。Thick film pastes was prepared by using LSCO produced by traditional solid-phase synthesis as the functional phase, and using calcium borosilicate glass as the inorganic bonding phase in our experiments. The effects of the content of glass phase and the peak sintering temperature on the sheet resistance and the resistance temperature coefficient of the thick film resistors were studied in this paper. Results show that the rang of the thick film pastes with sheet resistance is from 1 kΩ/□ to 10 MΩ/□ and that the rang of the temperature coefficient of resistance is from -8 000×10^-6/□ to -5 000×10^-6/□ when the glass phase's mass is 3%-9% that of solid phase.
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