大功率白光LED封装技术  

Packaging Technology for High-Power White LED

作　　者：张寅[1] 施丰华[1] 徐文飞[1] 范供齐[1] 王海波[2] 

机构地区：[1]南京工业大学材料科学与工程学院,江苏南京210009 [2]南京工业大学电光源材料研究所,江苏南京210015

出　　处：《照明工程学报》2012年第3期52-55,共4页China Illuminating Engineering Journal

基　　金：国家高技术研究发展计划(863计划)(SQ2010AA0323083001);院士企业工作站(BM2010449);江苏省自然科学基金(SBK201021101)

摘　　要：近年来,大功率白光LED封装技术面临着巨大的挑战。在LED封装过程中,LED封装方法、材料、工艺和结构的选择,对LED的出光效率,可靠性,散热等方面有巨大的影响。本文从热学、电学和机械角度详细地评述了大功率白光LED封装技术。Packaging technique of high-power white LED is facing enormous challenge in recent years. In the process of LED packaging, the selection of LED packaging methods, materials, processes and structure has a great influence on LED light extraction efficiency, reliability, cooling and so on. The packaging technique of high-power white LED was summarized in detail in the view of thermology, electrics and mechanics.

关 键 词：大功率LED 封装工艺 固态照明 

分 类 号：TM923.34[电气工程—电力电子与电力传动]