硅的准分子激光直写刻蚀微细加工特性研究  

ON THE CHARACTERISTICS OF Si MICRO-FABRICATION BY DIRECT ETCHING OF EXCIMER LASER

作　　者：苑伟政[1] 马炳和[1] 李晓莹[1] 李铁军[2] 王丽戈[2] 刘晶儒[2] 

机构地区：[1]西北工业大学微机械与微细加工技术研究室,西安710072 [2]西北核技术研究所

出　　处：《机械工程学报》2000年第3期107-110,共4页Journal of Mechanical Engineering

基　　金：陕西省自然科学基金

摘　　要：针对微机械三维结构对准分子激光直写微细加工的要求，在试验研究基础上，讨论了硅已加工表面形貌、加工热与热影响区等特性，得出了加工脉冲数、能量与刻蚀深度间的相互关系。The characteristics of Si micro-fabrication for MEMS by direct etching of KrF excimer laser, such as the machined topography, heat situation and thermal affecting zone are studied based on experiment. The duality empirical formula which can reflect the relationship between etching depth and number of pulses, laser energy is obtained and then analyzed.

关 键 词：准分子激光 硅微细加工 直写刻蚀加工 

分 类 号：TN304.12[电子电信—物理电子学] TN305.7