沉积压力对磁控溅射Mg薄膜结构的影响  

Effects of deposition pressure on Mg thin film during magnetron sputtering

作　　者：毛飞雄[1] 刘涛[1] 于景坤[1] 

机构地区：[1]东北大学材料与冶金学院,沈阳110819

出　　处：《材料与冶金学报》2012年第2期102-104,110,共4页Journal of Materials and Metallurgy

基　　金：国家自然科学基金资助(No.50904016)

摘　　要：采用直流磁控溅射方法在氧化锆固体电解质表面制备了Mg金属薄膜,利用XRD和SEM研究了沉积压力(0.9～2.1 Pa)对薄膜形貌和结构的影响.结果表明:随着沉积压力的提高,薄膜结晶程度逐渐变差,晶粒尺寸减小,表面粗糙度增大;薄膜呈(002)择优生长的柱状晶结构,且随着沉积压力的提高薄膜厚度先增加后减小.Mg thin films were prepared by direct current magnetron sputtering on the surface of solid electrolyte of ZrO2 （MgO）. The surface morphology and structure of the Mg thin films under different deposition pressure were investigated by XRD and SEM. The results show that the Mg films deposited at deposition pressures of 0. 9 Pa, 1.5 Pa and 2. 1 Pa are mainly of hexagonal phase with the crystal planes （002） in highly preferred orientation. The crystallinity and grain size of the films decrease, the surface roughness increases as the deposition pressure increases. The thickness of Mg films increases first, and then decreases with the increasing deposition pressure.

关 键 词：磁控溅射 Mg薄膜 沉积压力 

分 类 号：TF341.5[冶金工程—冶金机械及自动化]