125mm低阻硅抛光片清洗技术研究  

Research on Processing Technology of 5 inch Silicon Polished Wafers

作　　者：耿莉[1] 杨洪星[1] 

机构地区：[1]中国电子科技集团公司第四十六研究所,天津300220

出　　处：《电子工业专用设备》2012年第6期46-48,共3页Equipment for Electronic Products Manufacturing

摘　　要：在125 mm(5英寸)硅抛光片清洗过程中,发现硅片边缘容易出现"色斑"现象。对这一现象进行了分析,通过工艺试验,消除了这种现象。With the improvement of microelectronic technology, the size of polished wafers had greatly grown, the surface quality of the polished wafers had been perfect more and more. The automatic wet process bench had been widely used. In the article, one wet bench made in PR China had been used to clean the silicon polished wafers. The stain defects on the wafer surface had been found during the experiment and adjustment, the stain defects had been analyzed and successfully resolved by several experiments.

关 键 词：硅 清洗技术 色斑 

分 类 号：TN305.97[电子电信—物理电子学]