一种应用于全印制电子沉铜催化浆料制备及其应用  

Synthesis of silver crosslinked activated slurry and its application for RFID

作　　者：罗观和[1] 陈世荣[1] 胡光辉[1] 潘湛昌[1] 黄奔宇 徐青松 吴育帜 孙彬 

机构地区：[1]广东工业大学,广东广州510006 [2]安捷利(番禺)电子实业有限公司,广东广州511458

出　　处：《印制电路信息》2012年第4期143-146,共4页Printed Circuit Information

摘　　要：制备出一种应用于全印制电子沉铜催化浆料,采用电化学工作站的开路电位-时间(OCP-t)的技术,测定活化浆料引发沉铜的Emix-t曲线,比较不同含银量对引发过程的影响;在此基础上,应用于制造电子标签(RFID)。结果表明:随银含量增大,缓慢生成铜活性中心的诱导时间越短,活性越高;沉铜催化浆料及其对应的工艺加成法制作的电子标签导电性和结合力符合工业化要求,可以作为一种全印制电子技术来推广应用。Novel activated slurry with the cross-linking of silver （Ag） was successfully synthesized in this study. Emix-t curve of the activated slurry was measured by Open potential-time（OCP-t） technology in Electrochemical workstations. From the Emix-t curve, We could know that the induce time x of activated slurry became shorter and the catalytic activity was higher as the silver concentration increased. The conductivity and binding force of RFID tags both corresponded with standard of industrialization, which were manufactured by technology of activated slurry. So, this technology was widely applied to the field of Print Full Electronic Technology.

关 键 词：沉铜催化浆料 化学沉铜 OCP-t技术 

分 类 号：TN41[电子电信—微电子学与固体电子学]